BYD's semiconductor foundry business mainly consists of wafer manufacturing, packaging and testing. Products cover automotive IGBT and FRD wafer manufacturing, DFN/QFN packaging and testing, Wafer dicing, wafer testing, finished product testing and other services. Wafer dicing capability covers Si wafer, Taiko wafer , SiC wafer cutting and other processes; testing capability can provide CP, FT, Tri-Temp ,as well as other customized product testing and development services.
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